Title:

Assembly Process Developement Engineer

Location:

Surrey

Salary:

None specified

Description:

Our client is a global semiconductor manufacturer, and they are now looking for an IC Package Process DevelopmentEngineer to evaluate new materials, equipment and processes for semiconductor packages. Transferring new backend assemblyprocesses to production and interfacing with package and product designers will be required.Desired qualifications;-- IC Semiconductor assembly / packaging experience- Experience in product development or research (industrial or academic)- Process knowledge including spray processes, die attach, component placement, under fill, saw and wafer level processes- SPC, DOE and FMEA knowledge beneficial- BSc or higher degree in Physics/Electronic Engineering/Materials Science or equivalentPlease call to discuss further.